Resource eNewsletter - December Edition

View Web Version  |  Add to Safe Sender List AVIATION WEEK eBulletin   December 4, 2014 TODAY'S FEATURES Bolden Meets Human-Spaceflight Chief During China Visit Aviation Week Intelligence Network NASA Administrator Charles Bolden met with Wang Zhaoyao, director of the China Manned Space Engineering Office (CMSEO), during a visit to Beijing last month that was organized – with congressional approval – to share information on air traffic management. FULL ARTICLE EU: U.S.'s Delay In Granting Norwegian Application Breaches Open Skies Deal Aviation Daily The European Commission will start discussing with its members states the actions it could take to press the U.S. authorities to approve low-cost carrier Norwegian’s application for a foreign air carrier license for its Irish subsidiary, Norwegian Air International. FULL ARTICLE NATO Faces AWACS Fleet Shrinkage Aviation Week & Space Technology NATO might be calling on its members to raise their defense spending, but if the alliance’s airborne early warning program is anything to go by, that message may be falling on deaf ears. FULL ARTICLE Cessna Caravan Finding New Popularity With Asian Operators Aviation Week & Space Technology While Cessna Aircraft hopes its flurry of new business jet models will help lift it from general aviation’s long-mired marketplace, the aircraft generating smiles in Wichita of late is neither sexy nor new. FULL ARTICLE GALLERY Combat Aircraft AviationWeek.com These photos and the brief summaries with them draw on data and information compiled by Dan Katz of the Aviation Week Intelligence Network. FULL ARTICLE RECENT BLOGS The Muddy Waters Of Australia's Submarine Project Ares It seems as though every day brings a different “definitive” story about the Australian submarine requirement to replace its troubled Collins-class submarines. FULL ARTICLE 12/3 Frago Ares Defense news from around the Web FULL ARTICLE   Advertisement MOST READ ON AVIATIONWEEK.COM Opinion: Plenty Of Risk Remains For The F-35 Program NTSB 787 Battery Recommendations Focus On Processes, Quality, Oversight The Growing Reach Of India’s Space Program Opinion: China’s Radar and Missile Work Means More Than Fighters Advertisement Calendar of Upcoming Events MRO Latin America  January 13-14, 2015 Buenos Aires, Argentina MRO Middle East February 2-3, 2015 Dubai, UAE ATW's 41st Annual Airline Industry Achievement Awards February 25, 2015 Washington, DC 58th Annual Laureate AwardsMarch 5, 2015 Washington, DC Advertisement     UNSUBSCRIBE       SUBSCRIBE       ARCHIVES ABOUT THIS NEWSLETTER You are subscribed to this newsletter asdrvijaypithadia@gmail.com Penton | 1166 Avenue of the Americas, 10th Floor | New York, NY 10036

Metrology and Failure Analysis ON-DEMAND WEBCAST: Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Speakers: Winfield Scott, Technology Director, Evans Analytical Group Carlos Beitia, Metrology and Defectivity Manager, CEA-Leti  View this Webcast Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants WHITE PAPER:  The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulates are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications. Download the White Paper

Upcoming Event THE CONFAB The Countdown to The 11th Annual ConFab is on! Make plans now to participate at the semiconductor manufacturing industry’s premier conference and networking event. The ConFab will be back at the Encore at the Wynn in Las Vegas May 19-22, 2015. Interested in presenting at The ConFab? The call for papers is now open. See more details on the 2015 conference and how to submit your abstract HERE. Presented by: Solid State Technology View more Details Additional Resources ON-DEMAND WEBCASTS Advanced Packaging Advances in Wet Processing and Wafer Cleaning  The Rise of MEMS Sensors Interested in presenting in a future Solid State Technology webcast? We are currently looking for speakers for several upcoming webcasts. Click HERE to contact an editor for a list of upcoming topics and more details. View More Webcasts